» 固化和后端半导体制造

提高生产率,提高质量,降低成本…

拥有全球范围内庞大的垂直炉安装数量,HELLER是许多领先的电子产品制造商的优选。正如我们是SMT回流焊的先驱一样……包括空气对流和氮气炉使用…我们目前是优先提供定制固化炉的企业。作为市场领先者,HELLER 的设备具有通用性、灵活性。HELLER的设计能力,可以为您特有的固化需求定制解决方案。

后道半导体制造设备

755微型垂直固化炉

微型垂直炉按每片150mm的载具厚度,4mm传动链条pin长度规格来计算,生产节拍可达25~60秒。最宽PCB板可达250mm。更可选择双轨道上料满足高产能需求。

860压力固化固化炉(PCO)

HELLER 压力固化炉适用于在粘合制程中低空洞及提高粘合剂强度需求,以及在晶圆封装和填充制程中应用广泛

是否有特殊应用需求?

Custom application for special and challenging Semiconductor manufacturing requirements.

配置您的回流焊炉

We make it easy for you to configure your oven-without having to listen to canned presentations or boring sales people.

安排在线演示

Schedule an online presentation and have your semiconductor manufacturing questions answered.

Pressure Curing Ovens & Back-End Semiconductor Manufacturing Equipment Videos

Heller's Semiconductor Manufacturing Equipment Global Network
Visit Us

We welcome you to visit any of our facilities -USA, Asia , Europe to get a closer look at our pressure curing ovens & back-end semiconductor manufacturing equipment and have all of your questions answered.

Industry-Leading Service & Support

We provide a global service network, supported by a 24-hour beeper number. And we offer leading-edge support through RMATS(Remote Modem-Accessible Technical Service). This state-of-the-art system enables our service engineers to access your oven's internal electronics and answer your questions, wherever you are, whenever you have a concern.

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